Over Damien
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Werkervaring
- QualcommLEAD ALTIUM RF PCB DESIGNERTELECOMMUNICATIEjanuari 2017 - juni 2025 (8 jaren en 5 maanden)Munich, Germany• Creating Procedures, systems and best work practices for the team to follow• Complex BGA/LGA/0201/High Temp multilayer RF PCB Layout• Track Impedance calculations / SMA/ SMP Connectors• High Temp Military Specification Component evaluation.• Creation of Schematic Symbols / PCB Footprints / 3D Step Models• Creation of secure Access Database Library (.dbLib)• Design of Accelerated Stress Test Platform (bHAST & RFHTOL) PCBs• Drop test PCBs in accordance with the JEDEC STANDARDS• Development of High Temp Mobile Phone Module Test platforms• I2C, RF Power & Temp sensors• GERBERX2 files for PCB Houses, CAM Files etc.
- LM TechnologiesLEAD ALTIUM PCB DESIGN ENGINEERmei 2014 - augustus 2016 (2 jaren en 3 maanden)London, UKLEAD ALTIUM PCB DESIGN ENGINEER designing Wifi and Bluetooth USB and RS232 modules for industrial use
- ETL SystemsALTIUM PCB RF DESIGN ENGINEERjuni 2012 - augustus 2014 (2 jaren en 2 maanden)London, UKALTIUM PCB RF DESIGN ENGINEER designing Laying out PCBs for RF splitters for Satellite and military use.
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Opleidingen
- MASTER'S DEGREE (MSC.)University of ulster Jordanstown1999MASTER'S DEGREE (MSC.)
- BACHELOR DEGREE (BSC)University of Ulster1998BACHELOR DEGREE (BSC)